Partners’ news

New COM Express Type 10 Carrier Hosts Four AcroPack® mPCIe I/O Modules for a Mix of Processing Functions on a Mini-ITX Platform. Acromag broadens their family of rugged AcroPack mini-PCIe I/O module carrier cards with the new Model ACEX4041, which hosts a COM Express® Type 10 processor module. The Mini-ITX form factor board interfaces four […]

ADLINK and NVIDIA signed on 24 August 2018 NVIDIA Preferred Partner Master Agreement among Embedded GFX, HPC & DL solutions. That gives ADLINK direct access to Quadro-Embedded GPU, direct Tech Supports from NVIDIA HQ/RBU, direct business with NVIDIA on Embedded graphic/DL products. ADLINK is the unique company from ASIA/PACIFIC area accessing such level of partnership […]

ADLINK’s DDS-based TSS Software is Aligned to the FACE™ Technical Standard for the Aviation Sector. ADLINK, represented in France by ECRIN Systems, provides leading Edge Computing solutions that drive data-to-decision applications across industries globally. ADLINK Technology has, last December 2018, announced that its Data Distribution Service (DDS) based Transport Services Segment (TSS) software is aligned […]

ADLINK Announces EN-50155 certificated Driver Machine Interface Touch Panel Computer Designed for Train Control and Railway Signaling. ADLINK Technology, represented in France by ECRIN Systems, released end of January 2019, its latest Driver Machine Interface (DMI) touch panel computer, the DMI-1210, designed specifically for train control and driver information display. Powered by the Intel Atom® […]

3U cPCI-3630 and 6U cPCI-6636, two New CompactPCI® 2.0 Processor Blades Powered by Latest Intel® Xeon®, Core™ and Atom® Processors, further enhance ADLINK’s extensive, rugged CompactPCI processor blade portfolio. They provide technology upgrade solutions for railway transportation, military, aviation and industrial automation. ADLINK’s cPCI-3630 is a 3U CompactPCI processor blade featuring the 64-bit Intel Atom® Processor […]

Celebrating 25 years, PICMG will organise special events during the Embedded World 2019 (February 26-28, Nuremberg) on their booth in 3A-528 and on 40x PICMG member’s booths that will show off their offering. PICMG will organise two Presentation sessions on Wednesday 27, starting at 3 : 00 pm, on PICMG-OSM booth 3A-528 : – COM Express […]

The Data Intelligence Cluster, brings together the best of breed French end-to-end intelligence solutions. Its products and services independent portfolio, provided by the most innovative French companies in the intelligence space, fits customer needs, whether it is about consulting, conception, implementation, or maintenance. The GICAT Data Intelligence Cluster, as a single point of contact architect, […]

Acromag’s new 3U CPCI-S.0 board interfaces two ruggedized mPCIe analog I/O, digital I/O, serial communication, and FPGA mezzanine modules to an embedded computing system. Acromag, Inc. releases their ACPS3310 3U CompactPCI Serial mezzanine module carrier card for embedded measurement and control applications. The board has two AcroPack module slots to accommodate a wide variety of […]

VadaTech uses a consistent internal product architecture to generate a family of high-performance analog I/O modules in both 3U Open VPX and AMC form factor. This architecture makes use of the high speed serial links (JESD204B), found in most modern ADC and DAC chips, as the interface from I/O to the FPGA, via FMC standard […]

Long-life high-performance Industrial SSI Motherboard Dual INTEL® XEON® Scalable Performance (Skylake-SP) processors (LGA3647) & 7 PCIE slots Astonishing performance using multi-core CPUs & revision-controlled long-life components designed for rugged environments. Stress-tested for extreme shock & vibe settings, making it the perfect choice for industrial, military, and other harsh-climate computing applications. Comes standard with TPM 2.0, […]

24 NVMe drives in a 2U, 410mm short-depth & lightweight rugged chassis 25.6GB/s read/write speeds & as much local storage today’s SSDs can handle A new “storage” product targeted at MIL applications requiring up to 24 NVMe drives with tool-less carriers. This configuration supports three 8x SSD canisters for fast removable at the end of […]

Rugged MIL-STD-1553 AcroPack embedded computing avionics modules introduced by Acromag. Our partner Acromag is introducing two rugged AcroPack MIL-STD-1553 communication modules based on the Mini PCI Express card standard — the AP571 and AP572 — for commercial off-the-shelf (COTS) military and commercial avionics applications. These Mini PCI Express mezzanine modules deliver a SWaP-optimized solution for […]

First COM Express Type 6 Module to support Hexa-core Intel® Core™ & Xeon® Processors aimed at performance-demanding applications. ADLINK introduces its latest COM Express Type 6 module, thus widening its offerings to fulfill the needs of even the most performance-demanding applications. ADLINK’s Express-CF module features the Intel® Xeon® and 8th generation Intel® Core™ processors (formerly […]

Reduced time to market and total cost of ownership with optimum flexibility, industrial-grade ruggedness and long life support. ADLINK Technology, a global provider of leading edge computing solutions that inspire creative user experience across industries, is pleased to introduce its SP (Smart Panel) solution, driving innovation in smart device development. The all-in-one open frame panel […]

The 20th of March 2018 E-Blast emailing developped and distributed  by AEROSPACE &DEFENSE ELECTRONICS Open the E-blast  

Trenton’s Modular Blade Systems (MBS) are ideal for size-constrained, high-end compute applications. Extremely rugged, yet lightweight, the MBS product line can be configured to meet your unique system requirements. Here are a few of chassis options: MBS1001 – 1U, 483mm depth, 2 separate processor boards (Xeon or Core) MBS1002 – 1U, 483mm depth, 1 processor […]

The newest Indutrial IoT-ready platform, the MXE-210 offers dual functionality as a Gateway and Controller Combined, in a rugged fanless and reliable design that make it an ideal IIoT-ready platform with maximum functionality in minimum footprint (140mm x 110mm x 58mm) based on Intel® Atom™ E3900 Family-Based Processor (code named Apollo Lake-I):     Aluminum […]

The VT835 brings together the processing power of ATCA with the flexibility of the AMC form factor. The VT836 provides the same capability in a rugged, airborne-ready format. Both chassis are shipping now and seeing strong customer interest. The attached brochure shows how this architecture can be used across various example applications. View VT835/VT836 brochure […]

Acromag announced at the beginning of December 2017 the continued expansion of their AcroPack® Series with the AP226 and AP236 These modules provide built-in isolated voltage output signals to drive up to eight devices. Designed for COTS (commercial-off-the-shelf) these modules deliver high-density, high-reliability, and high-performance at a low cost. They support six independent software selectable […]

AcroPack® PCIe Bus interface boards provide customizable I/O in the µONYX SFF computer without the need for interface cables or secondary modules. Wixom, MI – October 2 – 2017. Acromag announced today the integration of their AcroPack I/O product line into the µONYX SFF Computer from ECRIN Systems in France. ECRIN Systems is a valued […]

This versatile Video Processing Unit (VPU) board includes both an advanced NVIDIA Quadro Pascal GPU and a Frame Grabber eXtreme (FGX). The board accepts up to two simultaneous 3G-SDI inputs and CVBS/STANAG inputs. The video data can be routed to the powerful Pascal GPU for processing or encoding, and then output in several formats, including […]

To complete ECRIN System Integrator offer in terms of RADAR, SONAR, SIGINT, EW applications with its new TOPAZE D platform based on 3U VPX, VADATECH proposes a strong and long term partnership portfolio of products in signal conversion and sensor processing. Actually, VADATECH is porting its new development modules and success story functions from AMC […]

WOLF Pascal-Based XMC Video Boards bring Tremendous Processing/Watt Advantages to Aerospace and Defense. WOLF Advanced Technology announces new XMC boards which integrate NVIDIA® Quadro® Pascal™ GP107, 2.3 TFLOP GPUs, designed to operate in harsh aerospace and defense environments. These new, chip-down XMC boards are tested to meet MIL-STD-810 and MIL-HDBK-217, and meet the quality standards […]

TEWS Technologies announced in July 2017 a standard full PCI Express Mini Card with a user programmable Kintex-7 FPGA, AD/DA, and digital I/O channels. The TMPE627 is designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required. It provides a number of advantages including a customizable interface for unique customer […]

TEWS Technologies increases its I/O offering with the TXMC638, a standard single-width Switched Mezzanine Card (XMC) compatible module providing a user configurable Kintex-7 FPGA with 24 ADC input channels. Designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required, the TXMC638 provides a number of advantages including a customizable interface […]

VadaTech continues to push the bandwidth, sample rate and capability of our RF modules. The AMC597, for example, uses quad AD9371 to provide eight wideband transceivers in a single-module AMC, while the VPX597 provides the same architecture in 3U OpenVPX form factor. The user can access the extensive capabilities of the AD9371 using Analog Devices […]

VadaTech is now shipping carriers and FMC modules to the FMC+ (VITA 57.4) specification. These make use of the higher number of serial lanes on the FMC+ connector to support more devices using JESD204B for high-speed ADC/DAC. Examples include the FMC250, which provides dual AD9625 ADCs providing 12-bit conversion rates of up to 2.6 GSPS, […]

Dual DAC 12 GSPS, dual ADC 6.4 GSPS, Kintex UltraScale, 3U VPX For COMINT/SIGINT, Radar signal processing The VPX599 provides dual-channel ADC with sample rates of up to 6.4 GSPS at 12-bits and a dual DAC update rate of up to 12 GSPS and direct RF synthesis at 6 GSPS at 16-bits making it suitable […]

Acromag’s New AcroPack® Carrier Cards Offer More I/O Options for VPX, XMC and PCI Express Embedded Systems AcroPack® Series of I/O mezzanine modules and carriers provide a cost-effective solution for a modular approach to system assembly enabling application-specific customization. Acromag expands their tech-refresh design of the AcroPack Series to include a superb selection of I/O […]

The new AcroExpress™ SBC provides extensive I/O support plus a fully integrated heatsink for advanced cooling management. Acromag, Inc., the leader in industrial I/O, announced the release of the AcroExpress™ VPX6600 3U OpenVPX single board computer. The VPX6600 series utilizes the 6th Generation Skylake Intel® Xeon® processor and C230 PCH chipset for extensive I/O support. […]

Several long-life Intel® Xeon® E3-1200 v6 and 7th Generation Intel® Core™ Processors; formally known as Kaby Lake, are now available for your industrial and military computer system designs. The updated TKL8255 SBC datasheet explains these new Kaby Lake processor options. The new TKL8255 application note provides the benchmark performance data for these latest processor options.

Is your VME application hungry for an upgrade? You Need Acromag’s Triple Decker! Acromag offers you to supercharge your VME application and save precious card slots to reduce costs. Build your next upgrade with the three easy steps below. 1. Select a VME single board computer, choose Intel Celeron or Intel Core i7 Processors. 2. […]

Halstenbek, Germany – 1st November, 2016: The TXMC590 is a standard Switched Mezzanine Card (XMC) compatible module offering 16 channels capable of measuring thermocouples, resistive sensors like RTD and thermistors, and strain gauges. Released as an extension to TEWS’ growing portfolio of XMC modules, the TXMC590 is designed for industrial control, telecommunication infrastructure, medical equipment, […]

ADLINK, a Taiwanese provider of modules for Internet-connected applications and equipment, intelligent interfaces and cloud-based services, launched the MICA (Modular Industrial Cloud Architecture) architecture this 2016 summer. This new architecture for Internet-connected object applications for off-the-shelf platforms is designed to optimize the performance, cost and space required for next-generation industrial IoT solutions. MICA, the ADLINK’s […]

ADLINK announces its first board in CompactPCI Serial format based on 4th/5th Generation INTEL Core i7 Processor with ECC memory. The good old CompactPCI was introduces in the 1994s. While it is not as old as the famous VME dating back to the 1980s, it is based just like its predecessor on a parallel backplane […]

ADLINK takes advantage of the transition of its MATRIX range, integrated versions and with PCIe I/O boards, to the new 6th Generation INTEL Core-i7  processor (codename SkyLake) to offer even more embedded functions. The MXC-6400 and MXE-5500 models have 6th Génération Intel Core i7/i5/i3  CPU and QM170 companion chipset, offering 70% increase in performance for […]

ADLINK announces the new version 3.5 of its Smart Embedded Management Agent (SEMA), a monitoring middleware found on almost all the embedded cards of the Taiwanese manufacturer. This new version enhances the reliability and security of modules and systems based on ADLINK embedded boards, such as ECRIN Systems’s ONYX, OPALE V2 and CRYSTAL computers. With SEMA […]

Halstenbek, Germany – 14th September 2016. TEWS TECHNOLOGIES increases its product portfolio of PCI Express carriers. The TPCE278 is a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module. (more…)

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