About myOPALE Modular Building Blocks for AI on the Edge

Issued in ECE/Boards & Solutions dated March 2019

Launched in February 2018 at Embedded World in Germany, myOPALE building blocks provide truly disruptive technology to realize your design goals for industrial computers that target size, weight, and power consumption (SWaP)-constrained operating environments.
The myOPALE modular concept is based on four key points, all inspired by open or de facto standards used in the embedded market. It eliminates the mechanical link between the CPU module and its I/O cards thanks to PCI Express Gen3-overcable interconnection. It uses a standard half-height 5.25-inch casing.

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