Author Archive | Ecrin Systems

OPALE V2-MIL-Compact-Une

OPALE V2-MIL Compact for sea environment

MIL-STD Qualified stainless steel short-Server to reduce downtime in harsh environments. Military and industrial professionals choose ECRIN Systems Rugged Servers when they need high-performance computing and high-capacity data storage in a rugged, stainless-steel package able to withstand some of the roughest terrains and toughest applications. OPALE V2-MIL Compact highly customizable Rugged Servers are used by […]

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Xilinx FPGA-Une

XILINX FPGA toolbox from VADATECH for your next VPX project

VadaTech uses a consistent internal product architecture to generate a family of high-performance analog I/O modules in both 3U Open VPX and AMC form factor. This architecture makes use of the high speed serial links (JESD204B), found in most modern ADC and DAC chips, as the interface from I/O to the FPGA, via FMC standard […]

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SSP8268 – SSI motherboard with 5 years warranty

Long-life high-performance Industrial SSI Motherboard Dual INTEL® XEON® Scalable Performance (Skylake-SP) processors (LGA3647) & 7 PCIE slots Astonishing performance using multi-core CPUs & revision-controlled long-life components designed for rugged environments. Stress-tested for extreme shock & vibe settings, making it the perfect choice for industrial, military, and other harsh-climate computing applications. Comes standard with TPM 2.0, […]

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RSC2403 JBOD Chassis-Une

RSC2403 JBOD Chassis with 25.6 GB/s recording bandwidth

24 NVMe drives in a 2U, 410mm short-depth & lightweight rugged chassis 25.6GB/s read/write speeds & as much local storage today’s SSDs can handle A new “storage” product targeted at MIL applications requiring up to 24 NVMe drives with tool-less carriers. This configuration supports three 8x SSD canisters for fast removable at the end of […]

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AP571 and AP572 – MIL-STD-1553 AcroPack for rugged computers

Rugged MIL-STD-1553 AcroPack embedded computing avionics modules introduced by Acromag. Our partner Acromag is introducing two rugged AcroPack MIL-STD-1553 communication modules based on the Mini PCI Express card standard — the AP571 and AP572 — for commercial off-the-shelf (COTS) military and commercial avionics applications. These Mini PCI Express mezzanine modules deliver a SWaP-optimized solution for […]

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Express CF-CFE-Une

Express-CF/CFE : the first 6-Core i7/Xeon COMe Type 6

First COM Express Type 6 Module to support Hexa-core Intel® Core™ & Xeon® Processors aimed at performance-demanding applications. ADLINK introduces its latest COM Express Type 6 module, thus widening its offerings to fulfill the needs of even the most performance-demanding applications. ADLINK’s Express-CF module features the Intel® Xeon® and 8th generation Intel® Core™ processors (formerly […]

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SP-AL Series-Une

SP-AL Series – Smart Panel by ADLINK from 7 to 21.5”, operating between -20°/+70° C

Reduced time to market and total cost of ownership with optimum flexibility, industrial-grade ruggedness and long life support. ADLINK Technology, a global provider of leading edge computing solutions that inspire creative user experience across industries, is pleased to introduce its SP (Smart Panel) solution, driving innovation in smart device development. The all-in-one open frame panel […]

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Intel chip

ALERT on INTEL chips shortage

Intel have officially entered a period of ‘constraint’ on desktop supply which places legal commitments on them. But it will affect also our embedded market. So be very careful to engage your order in advance, because for some references, the lead-time move from 8 to 18 weeks. Why is this happening now? Higher than expected […]

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Conduction cooled platforms

Conduction cooled platforms

In its 2019 Rugged Computers roadmap, ECRIN Systems will cover all your requirements with only five platforms. The target is to offer our customers with one unique flexible qualified platform type per application and environmental conditions. That will simplify your choice, reducing your Time to Market, minimizing the change-risk and increasing your Return on Investment […]

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