AcroPack® PCIe Bus interface boards provide customizable I/O in the µONYX SFF computer without the need for interface cables or secondary modules.
Wixom, MI – October 2 – 2017. Acromag announced today the integration of their AcroPack I/O product line into the µONYX SFF Computer from ECRIN Systems in France. ECRIN Systems is a valued distributor of Acromag Embedded Solutions and has steadily expanded their capabilities to include the design and manufacture of their own small form factor computer solutions.
Inside the µONYX is one AcroPack I/O expansion slot that provides the unit with enhanced capability without the need for interface cables or secondary module. Any of the over 20 AcroPack modules can be easily installed into the unit providing -40 to 85°C operation and less than 5 Watts per module power consumption. This configuration offers the optimal SWaP configuration for the user’s application.
“Thanks to AcroPack’s new form factor, we greatly improved the performance of our new µONYX mission computer when used in harsh environments like UAV’s, rotary or fixed Aircrafts and ground vehicles where shock and vibration is a huge constraint,” said Elie Gasnier, Marketing Director at ECRIN Systems. “Acromag reinvented the famous Industry Pack mezzanine board of the 90’s with modern PCIe, SATA, and USB serial interconnect protocols. And without any cabling or secondary module we had to add with a miniPCIe mezzanine, all AcroPack signals route via the carrier PCB to MIL-DTL-38999 circular I/O connectors.”
Russ Nieves, Vice President of Sales for Acromag says “This is a great addition to our partnership with ECRIN. The acceptance and integration of the AcroPack platform into ECRIN µONYXproduct line helps to solidify its acceptance in the industry as a significant PCIe-based I/O platform for the future.”
The AcroPack® product line updates Acromag’s popular Industry Pack I/O modules with a PCIe interface format. This tech-refresh design offers a compact size, low-cost I/O, the same functionality as the existing Industry Pack modules and a rugged form factor.
Designed for COTS applications these FPGA based digital I/O modules deliver user-customizable I/O, high-density, high-reliability, and high-performance at a low cost.