Archive | Partners’ News

TXMC638

TEWS adds new user-programmable FPGA module to expanding line of XMCs

TEWS Technologies increases its I/O offering with the TXMC638, a standard single-width Switched Mezzanine Card (XMC) compatible module providing a user configurable Kintex-7 FPGA with 24 ADC input channels. Designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required, the TXMC638 provides a number of advantages including a customizable interface […]

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AMC597 FMC154-2

Vadatech RF Sub-Systems

VadaTech continues to push the bandwidth, sample rate and capability of our RF modules. The AMC597, for example, uses quad AD9371 to provide eight wideband transceivers in a single-module AMC, while the VPX597 provides the same architecture in 3U OpenVPX form factor. The user can access the extensive capabilities of the AD9371 using Analog Devices […]

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AMC583 FMC250-2

FMC+ by Vadatech

VadaTech is now shipping carriers and FMC modules to the FMC+ (VITA 57.4) specification. These make use of the higher number of serial lanes on the FMC+ connector to support more devices using JESD204B for high-speed ADC/DAC. Examples include the FMC250, which provides dual AD9625 ADCs providing 12-bit conversion rates of up to 2.6 GSPS, […]

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Acromag offers new I/O options for PCIe/XMC/VPX

Acromag’s New AcroPack® Carrier Cards Offer More I/O Options for VPX, XMC and PCI Express Embedded Systems AcroPack® Series of I/O mezzanine modules and carriers provide a cost-effective solution for a modular approach to system assembly enabling application-specific customization. Acromag expands their tech-refresh design of the AcroPack Series to include a superb selection of I/O […]

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Acromag-VPX6600

Acromag’s new 3U VPX SBC features Xeon CPU

The new AcroExpress™ SBC provides extensive I/O support plus a fully integrated heatsink for advanced cooling management. Acromag, Inc., the leader in industrial I/O, announced the release of the AcroExpress™ VPX6600 3U OpenVPX single board computer. The VPX6600 series utilizes the 6th Generation Skylake Intel® Xeon® processor and C230 PCH chipset for extensive I/O support. […]

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trenton TKL8255

Trenton Systems launches its new TKL8255 single board

Several long-life Intel® Xeon® E3-1200 v6 and 7th Generation Intel® Core™ Processors; formally known as Kaby Lake, are now available for your industrial and military computer system designs. The updated TKL8255 SBC datasheet explains these new Kaby Lake processor options. The new TKL8255 application note provides the benchmark performance data for these latest processor options.

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Acromag-VME-COMP

Acromag offers to supercharge your VME application

Is your VME application hungry for an upgrade? You Need Acromag’s Triple Decker! Acromag offers you to supercharge your VME application and save precious card slots to reduce costs. Build your next upgrade with the three easy steps below. 1. Select a VME single board computer, choose Intel Celeron or Intel Core i7 Processors. 2. […]

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TEWS Technologies introduces 16 channel thermocouple/RTD/strain-measurement XMC

Halstenbek, Germany – 1st November, 2016: The TXMC590 is a standard Switched Mezzanine Card (XMC) compatible module offering 16 channels capable of measuring thermocouples, resistive sensors like RTD and thermistors, and strain gauges. Released as an extension to TEWS’ growing portfolio of XMC modules, the TXMC590 is designed for industrial control, telecommunication infrastructure, medical equipment, […]

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mica

MICA – Modular and open architecture modulaire for industrial Cloud applications

ADLINK, a Taiwanese provider of modules for Internet-connected applications and equipment, intelligent interfaces and cloud-based services, launched the MICA (Modular Industrial Cloud Architecture) architecture this 2016 summer. This new architecture for Internet-connected object applications for off-the-shelf platforms is designed to optimize the performance, cost and space required for next-generation industrial IoT solutions. MICA, the ADLINK’s […]

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