Archive | Partners’ News


Acromag’s new 3U VPX SBC features Xeon CPU

The new AcroExpress™ SBC provides extensive I/O support plus a fully integrated heatsink for advanced cooling management. Acromag, Inc., the leader in industrial I/O, announced the release of the AcroExpress™ VPX6600 3U OpenVPX single board computer. The VPX6600 series utilizes the 6th Generation Skylake Intel® Xeon® processor and C230 PCH chipset for extensive I/O support. […]

Continue Reading
trenton TKL8255

Trenton Systems launches its new TKL8255 single board

Several long-life Intel® Xeon® E3-1200 v6 and 7th Generation Intel® Core™ Processors; formally known as Kaby Lake, are now available for your industrial and military computer system designs. The updated TKL8255 SBC datasheet explains these new Kaby Lake processor options. The new TKL8255 application note provides the benchmark performance data for these latest processor options.

Continue Reading

Acromag offers to supercharge your VME application

Is your VME application hungry for an upgrade? You Need Acromag’s Triple Decker! Acromag offers you to supercharge your VME application and save precious card slots to reduce costs. Build your next upgrade with the three easy steps below. 1. Select a VME single board computer, choose Intel Celeron or Intel Core i7 Processors. 2. […]

Continue Reading

TEWS Technologies introduces 16 channel thermocouple/RTD/strain-measurement XMC

Halstenbek, Germany – 1st November, 2016: The TXMC590 is a standard Switched Mezzanine Card (XMC) compatible module offering 16 channels capable of measuring thermocouples, resistive sensors like RTD and thermistors, and strain gauges. Released as an extension to TEWS’ growing portfolio of XMC modules, the TXMC590 is designed for industrial control, telecommunication infrastructure, medical equipment, […]

Continue Reading

MICA – Modular and open architecture modulaire for industrial Cloud applications

ADLINK, a Taiwanese provider of modules for Internet-connected applications and equipment, intelligent interfaces and cloud-based services, launched the MICA (Modular Industrial Cloud Architecture) architecture this 2016 summer. This new architecture for Internet-connected object applications for off-the-shelf platforms is designed to optimize the performance, cost and space required for next-generation industrial IoT solutions. MICA, the ADLINK’s […]

Continue Reading

cPCI Serial

ADLINK announces its first board in CompactPCI Serial format based on 4th/5th Generation INTEL Core i7 Processor with ECC memory. The good old CompactPCI was introduces in the 1994s. While it is not as old as the famous VME dating back to the 1980s, it is based just like its predecessor on a parallel backplane […]

Continue Reading

Matrix 6400 & 5500

ADLINK takes advantage of the transition of its MATRIX range, integrated versions and with PCIe I/O boards, to the new 6th Generation INTEL Core-i7  processor (codename SkyLake) to offer even more embedded functions. The MXC-6400 and MXE-5500 models have 6th Génération Intel Core i7/i5/i3  CPU and QM170 companion chipset, offering 70% increase in performance for […]

Continue Reading

ADLINK announces the new version 3.5 of SEMA

ADLINK announces the new version 3.5 of its Smart Embedded Management Agent (SEMA), a monitoring middleware found on almost all the embedded cards of the Taiwanese manufacturer. This new version enhances the reliability and security of modules and systems based on ADLINK embedded boards, such as ECRIN Systems’s ONYX, OPALE V2 and CRYSTAL computers. With SEMA […]

Continue Reading