Author Archive | Ecrin Systems

TXMC638

TEWS adds new user-programmable FPGA module to expanding line of XMCs

TEWS Technologies increases its I/O offering with the TXMC638, a standard single-width Switched Mezzanine Card (XMC) compatible module providing a user configurable Kintex-7 FPGA with 24 ADC input channels. Designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required, the TXMC638 provides a number of advantages including a customizable interface […]

Continue Reading
AMC597 FMC154-2

Vadatech RF Sub-Systems

VadaTech continues to push the bandwidth, sample rate and capability of our RF modules. The AMC597, for example, uses quad AD9371 to provide eight wideband transceivers in a single-module AMC, while the VPX597 provides the same architecture in 3U OpenVPX form factor. The user can access the extensive capabilities of the AD9371 using Analog Devices […]

Continue Reading
AMC583 FMC250-2

FMC+ by Vadatech

VadaTech is now shipping carriers and FMC modules to the FMC+ (VITA 57.4) specification. These make use of the higher number of serial lanes on the FMC+ connector to support more devices using JESD204B for high-speed ADC/DAC. Examples include the FMC250, which provides dual AD9625 ADCs providing 12-bit conversion rates of up to 2.6 GSPS, […]

Continue Reading
Sensors-to-Server Strategy

Sensors-to-Server Strategy

Are you more Beatles or Rolling Stones fan, Steve Jobs or Bill Gates, x86 or PowerPC sponsor, Linux or Windows, VITA or PICMG? Sometimes, it is difficult to choose the best corner! Same in Embedded World! Just a few companies in the business of manufacturing systems using VITA technology develop products in other form factors, […]

Continue Reading
LOGO IDEF 2017

ECRIN Systems at IDEF 2017

Many visitors on ECRIN Systems booth located on French Pavilion at IDEF-Istambul in May 2017. With more than 120 visitors on our booth during the 4 days of the show, it is the best export trade fair that ECRIN Systems has ever achieved. The Middle East’s largest trade fair for the military and aviation industry […]

Continue Reading
Acromag-AP_Carrier_Group

Acromag offers new I/O options for PCIe/XMC/VPX

Acromag’s New AcroPack® Carrier Cards Offer More I/O Options for VPX, XMC and PCI Express Embedded Systems AcroPack® Series of I/O mezzanine modules and carriers provide a cost-effective solution for a modular approach to system assembly enabling application-specific customization. Acromag expands their tech-refresh design of the AcroPack Series to include a superb selection of I/O […]

Continue Reading
Acromag-VPX6600

Acromag’s new 3U VPX SBC features Xeon CPU

The new AcroExpress™ SBC provides extensive I/O support plus a fully integrated heatsink for advanced cooling management. Acromag, Inc., the leader in industrial I/O, announced the release of the AcroExpress™ VPX6600 3U OpenVPX single board computer. The VPX6600 series utilizes the 6th Generation Skylake Intel® Xeon® processor and C230 PCH chipset for extensive I/O support. […]

Continue Reading
trenton TKL8255

Trenton Systems launches its new TKL8255 single board

Several long-life Intel® Xeon® E3-1200 v6 and 7th Generation Intel® Core™ Processors; formally known as Kaby Lake, are now available for your industrial and military computer system designs. The updated TKL8255 SBC datasheet explains these new Kaby Lake processor options. The new TKL8255 application note provides the benchmark performance data for these latest processor options.

Continue Reading